Thin Wafer Market By 2027 – Drivers, Restraint & Future Growth
The thin wafer market analysis document represents a detailed collection of prioritized market definitions, industry scope and reach, and pivotal industry insights. Information about the many pitfalls of the market as well as the frequent challenges encountered by core industry players have been summarized in the report. That apart, the document also endorses details about the numerous driving parameters impacting the revenue landscape of this vertical.
Thin wafers, which are the thin slices of semiconductor, are largely being used for manufacturing integrated circuits (ICs). They are extensively used across automotive sector owing to the elevating demand for AI-chipsets that are developed using thin wafer technology. Thin wafers offer enhanced performance, energy efficiency, as well as reduced footprint making it suitable for an automotive environment. Automotive OEMs are showing higher inclination towards ADAS, self-driving and autonomous vehicles lately. This has urged the companies to adopt autonomous system technologies that provide high performance and reliability solutions, which is impelling the demand for AI-based chipsets and modules. Citing an instance, in 2019, Arm inked a partnership agreement with Toyota and GM for developing driverless car chipsets and computing systems for self-driving vehicles. Such initiatives are opening new growth opportunities for thin wafer market over the foreseeable future.
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On account of rising product demand, various prominent players operating in thin wafer market are focusing on the development of technologically advanced offerings to meet the growing consumer demand. To illustrate, in 2020, ACM Research announced the launch of a thin wafer-based cleaning system that facilitates the production of power semiconductors such as IGBT and MOSFET. According to the company, this system offers touch-free processing which can eliminate possible wafer damage and improve the final device yield.
Growing adoption of thin wafers of thickness ranging between 50 μm and 99 μm to manufacture power semiconductors components like IGBTs and MOSFETs, is playing the key role in the segment growth. This reduced thickness helps in achieving higher energy efficiency and enhanced device stability in power semiconductors. Besides the emerging trend of High-Volume Manufacturing among silicon wafers companies with thickness 50 μm - 100 μm is further fostering the segment growth. Reportedly, 50 μm - 99 μm segment is expected to witness a significant CAGR of 7.0% through 2027.
Silicon based thin wafers with diameter of 300 mm provide greater yield for achieving economies of scale and increase the profitability of enterprises operating in wafer manufacturing sector. As a result, companies are focusing on adding new operational facilities for the product of 300 mm thin wafers. Quoting an instance, in 2021, Robert Bosch GmbH announced the establishment of a new semiconductor fabrication plant aimed at increasing the production capacity to cater to the growing demand from the automotive sector. According to the company, this plant will concentrate on producing 300 mm silicon wafers with thickness 60 μm.
Considering the increasing product adoption, 300 mm thin wafer segment had accounted for a market share of nearly 8.0% in 2020 and is anticipated to register a CAGR of 4.5% through 2027.
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Strong presence of prominent semiconductor manufacturers in Europe including Siltronic AG, Infineon Technologies AG, Nexperia, STMicroelectronics, GlobalFoundries, X-fab, etc. is one of the major factors driving the demand for thin wafer in the region. Favorable government initiatives and funding is positively influencing the business further. For instance, in 2018, the European Commission along with the UK, France, Germany and Italy announced a joint initiative for research and innovation in the fields of microelectronics and semiconductor.
Reportedly, the European Union had allocated USD 2.06 billion for the R&D activities and additional USD 7.05 billion for attracting foreign semiconductor manufacturers to the region. On account of these factors, thin wafer market in Europe is estimated to register a substantial CAGR of 6.5% through 2027.
Major Key Points from Table of Content:
Chapter 6 Thin Wafer Market, By Wafer Size
6.1 Key trends by wafer size
6.2 100 mm
6.2.1 Thin wafer market estimates and forecasts, 2016 – 2027
6.3 125 mm
6.3.1 Thin wafer market estimates and forecasts, 2016 – 2027
6.4 200 mm
6.4.1 Market estimates and forecasts, 2016 – 2027
6.5 300 mm
6.5.1 Market estimates and forecasts, 2016 – 2027
Chapter 7 Thin Wafer Market, By Process
7.1 Key trends, by process
7.2 Temporary bonding & debonding
7.2.1 Market estimates and forecasts, 2016 – 2027
7.2.2 UV-release adhesives
7.2.2.1 Market estimates and forecasts, 2016 – 2027
7.2.3 Thermal-release adhesives
7.2.3.1 Market estimates and forecasts, 2016 – 2027
7.2.4 Solvent-release adhesives
7.2.4.1 Market estimates and forecasts, 2016 – 2027
7.3 Carrier-less approach/Taiko process
7.3.1 Market estimates and forecasts, 2016 – 2027
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