According to GMI, Inc., thin wafer market size is estimated to exceed USD 9.5 billion by 2027. Thin wafers, which are the thin slices of semiconductor, are largely being used for manufacturing integrated circuits (ICs). They are extensively used across automotive sector owing to the elevating demand for AI-chipsets that are developed using thin wafer technology. Thin wafers offer enhanced performance, energy efficiency, as well as reduced footprint making it suitable for an automotive environment. Automotive OEMs are showing higher inclination towards ADAS, self-driving and autonomous vehicles lately. This has urged the companies to adopt autonomous system technologies that provide high performance and reliability solutions, which is impelling the demand for AI-based chipsets and modules. Citing an instance, in 2019, Arm inked a partnership agreement with Toyota and GM for developing driverless car chipsets and computing systems for self-driving vehicles. Such initiatives are opening new growth opportunities for thin wafer market over the foreseeable future.

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Besides automotive industry, thin wafer technology is gaining immense popularity for developing logic ICs that are widely used in data centers and high-performance computing applications. Thinning technology is highly preferred in logic devices in order to achieve high-speed processing and reconfigurations. As per the World Semiconductor Trade Statistics, in 2020, revenue generated from the sales of logic-based semiconductors was recorded as USD 113.42 billion and is expected to register 7.1% y-o-y growth, accounting for the revenue of USD 121.50 billion in 2021. With increasing sales of logic-based devices globally demand for thin wafers is rising providing positive growth prospects for the industry. Reportedly, logic application segment is anticipated to register a CAGR of 5.5% through 2027.

Considering the regional outlook, thin wafers industry is poised to generate lucrative growth opportunities from Europe. According to the report, Europe thin wafer market is projected to register a CAGR of 6.5% through 2027. This can be credited to the presence of prominent semiconductor companies like GlobalFoundries, Nexperia, Siltronic AG, STMicroelectronics, etc. In addition, favorable government initiatives and funding activities is complementing the growth of regional industry further.  For instance, in 2018, the European Commission along with the UK, Italy, France and Germany launched a joint project for research and development in the fields of microelectronics and semiconductor. EU approved the sanction of USD 2.06 billion for R&D activities and an additional USD 7.05 billion funds for attracting foreign semiconductor manufacturers to Europe.

Thin wafers come in different sizes and thickness based on their respective applications. With regards to size, thin wafers of 300 mm diameter are in high demand as they offer a greater yield for achieving economies of scale and increasing the profitability of the enterprises operating in wafer fabrication field. This has encouraged companies to focus on adding 300 mm operational facilities, which is positively influencing the business space. Quoting an instance, in 2021, Robert Bosch GmbH announced the launch of a new semiconductor fabrication plant, aimed at producing power semiconductors in automotive sector. According to the company, the new plant will manufacture silicon thin wafers of diameter 300 mm and thickness of 60 μm. On account of this burgeoning product demand, 300 mm segment had accounted for a market share of over 8.0% in 2020 and is estimated to register a robust CAGR of 4.5% through 2027.

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Speaking of the thickness, wafers with thickness between 50 μm and 99 μm are witnessing higher adoption for manufacturing power semiconductors. Power semiconductor components like IGBTs and MOSFETs require silicon wafer of thickness 50 μm to 55 μm as the reduced thickness helps in achieving higher energy efficiency and better device stability in power semiconductors. Additionally, growing adoption of High-Volume Manufacturing among the manufacturers of silicon wafers is fueling the product demand further. With elevating demand, 50 μm-99 μm segment is expected to record a CAGR of 7.0% through 2027.

Considering the increasing product demand, several key thin wafer market players are focusing on developing technologically advanced solutions to effectively meet the growing consumer demands. For instance, in 2020, ACM Research launched a thin wafer-based cleaning system that supports the production of IGBT and MOSFET especially for the power semiconductor industry. According to the company, this system features touch-free processing and handling that can eliminate possible wafer damage and enhance the final device yield.

Table of Contents (ToC) of the report:

Chapter 1   Methodology & Scope

1.1    Scope & definition

1.2    Methodology and forecast parameters

1.3    Data Sources

1.3.1    Secondary

1.3.2    Primary

Chapter 2   Executive Summary

2.1    Thin wafer market 360⁰ synopsis, 2016 – 2027

2.1.1    Business trends

2.1.2    Regional trends

2.1.3    Thickness trends

2.1.4    Wafer size trends

2.1.5    Process trends

2.1.6    Application trends

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